QP Technologies

QP Technologies, a microelectronic services firm based in Escondido, California, provides IC packaging and assembly, wafer preparation, and substrate design and development. Founded in 1992 and formerly known as Quik-Pak, the company rebranded under its current name in 2021 to reflect an expanded set of capabilities. It was acquired by Promex Industries in 2015.

Its service portfolio spans several stages of the microelectronics supply chain. Wafer preparation covers backgrinding, dicing, die sort and inspection. IC packaging includes over-molded QFN/DFN packages, pre-molded air-cavity QFN packages and custom substrate solutions. Advanced assembly work takes in flip-chip, stacked die, SiP, chiplets, MCM and chip-on-board techniques, complemented by design engineering support for microelectronic solutions.

Manufacturing takes place in a 20,000 square foot purpose-built facility, serving customers from prototyping through production volumes. End markets include automotive, aerospace, mil-aero, medical, industrial and commercial applications, as well as power and compound semiconductors. The company holds ISO 9001:2015, ISO 13485:2016 and AS9100D certifications and is ITAR registered, reflecting work for high-reliability and defence customers.